AMS: New water coolers and heat sinks profiles for IGBTs and press pack semiconductors
New heat sink profiles maxed out the feasibility limits of aluminum extrusions. Aluminum water coolers were especially designed to guarantee a uniform pressure distribution for press pack discs.
New designs of Webra aluminum water coolers include solutions for IGBT modules 140x190, 130x 140, Infineon PrimePack2 and PP3, EconoDual3, Semikron SKiiP3 and 4, SKiM63 and 93, Semipack2, Fuji Electric High Power 6-Pack, Mitsubishi/Powerex Mega Power Dual IGBT and others. Special universal designs that allow the use of two or more modules with differing drill patterns are also available. Thermo- and fluid dynamic behavior may be tailored to custom sets of IGBT modules. Webra aluminum water coolers utilize modern extrusions and safe seals with friction stir welding.
Brand new extrusion profiles offer 5-10% reduction in thermal resistance and/or reduced pressure drop. The new Webra profile W-209-60-15-41 is an evolution of the well known industry standard W-209-60-15-22. Other new profiles in widths 110, 220 and 380 mm distinguish themselves through relatively low profiles and high fin density that enable efficient heat transfer in the very vicinity of the heat sources.
For press pack semiconductors a uniform pressure distribution is vital as non-uniformity accelerates ageing or even destruction. Webra’s new unique makes of aluminum FSW water coolers offer a rigid construction, perfectly flat surfaces for ideal contact and excellent performance. The press pack cooler dimensions are 150x150x25 and is suitable for 5” and 6” discs. The design can be customized for smaller discs. Different options for disc centering and tools for replacement are available.
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AMS: New water coolers and heat sinks profiles for IGBTs and press pack semiconductors
08.04.2011
New heat sink profiles maxed out the feasibility limits of aluminum extrusions. Aluminum water coolers were especially designed to guarantee a uniform pressure distribution for press pack discs. New designs of Webra aluminum water coolers include solutions for IGBT modules 140x190, 130x 140, Infineon PrimePack2 and PP3, EconoDual3, Semikron SKiiP3 and 4, SKiM63 and 93, Semipack2, Fuji Electric High Power 6-Pack, Mitsubishi/Powerex Mega Power Dual IGBT and others. Special universal designs that allow the use of two or more modules with differing drill patterns are also available. Thermo- and fluid dynamic behavior may be tailored to custom sets of IGBT modules. Webra aluminum water coolers utilize modern extrusions and safe seals with friction stir welding.
Brand new extrusion profiles offer 5-10% reduction in thermal resistance and/or reduced pressure drop. The new Webra profile W-209-60-15-41 is an evolution of the well known industry standard W-209-60-15-22. Other new profiles in widths 110, 220 and 380 mm distinguish themselves through relatively low profiles and high fin density that enable efficient heat transfer in the very vicinity of the heat sources.
For press pack semiconductors a uniform pressure distribution is vital as non-uniformity accelerates ageing or even destruction. Webra’s new unique makes of aluminum FSW water coolers offer a rigid construction, perfectly flat surfaces for ideal contact and excellent performance. The press pack cooler dimensions are 150x150x25 and is suitable for 5” and 6” discs. The design can be customized for smaller discs. Different options for disc centering and tools for replacement are available.
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